Prepreg

Prepreg

 (70~120)℃ cure epoxy resin system  130℃ cure epoxy resin system  130℃ cure toughened epoxy resin system  130℃ cure

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Adhesive Film

Adhesive Film

 (70~120)℃ cure epoxy resin adhesive film  130℃ cure epoxy resin adhesive film  125℃ cure epoxy resin adhesive film(H

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PETG-CF

PETG-CF

Modify PETG with carbon fiber reinforcement materials added, to enhances the rigidity and toughness of PETG.

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PEEK

PEEK

PEEK material enamelled wire, environmentally friendty material, self-extinguishingCan sirultaneously meet high temperat

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PLA-LW

PLA-LW

Light weight pla filament is a material specially developed for aeromodelling. The interlayer bonding is stable, and the

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PMI foam

PMI foam

HyboFOAM® A is a closed-cell rigid foam based on polymethacrylimide (PMI), which contains no halogen at all. The cell si

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PA-CF

PA-CF

Nylon carbon fiber filament is developed based on nylon 6/66 copolymer, adding 20% carbon fiber greatly enhances the str

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PI-B

PI-B

Excellent electrochemical, thermal, mechanical, and chemical propertjes,good heat dissipation of the winding, and high m

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PA12+CF

PA12+CF

PA12+CF is a eSUN self-developed material based on PA12, it added 15% carbon fiber, greatly enhance the strength, rigidi

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PBO Prepreg

PBO Prepreg

It is a high-end composite intermediate prepared by using PBO fiber as the reinforcing substrate and matching with an ap

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PCBA纳米防水涂层

PCBA纳米防水涂层

在PCB板表面进行简单的涂覆,就可以得到优异的防水、防潮性能,对于电子零部件、精密仪器形成高性能的防油扩散及防潮保护层。

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