Beidou-3 Global Short Message Communication Module

The Beidou-3 Global Short Message Communication Module (hereinafter referred to as the "Module"), Model T739, integrates the functions of Beidou-2 regional short message communication, Beidou-3 regional short message communication and Beidou-3 global short message communication. It is internally integrated with RDSS transceiving RF channel chips, baseband chips, PA circuits and LNA circuits, and supports external SIM cards and active antennas. One-stage LNA and filters for S-band and B2b-band shall be externally installed at the antenna end. The module can supply power to the antenna through its RX port. The power amplifier circuit provides a transmitting power of 5W. Adopting stamp hole SMD packaging, the module features a compact size of only 40mm×40mm, high integration and low power consumption. It facilitates customers’ secondary application development based on Beidou-3 short message services.