Underfill for chips

This product is a one-component, modified epoxy adhesive that is easy to handle. It exhibits excellent flowability, enabling rapid penetration into BGA, CSP, and flip-chip assemblies, and cures quickly upon heating. It is thermally conductive, effectively reducing the internal temperature of chips. Key Performance Features: - Enhances mechanical strength, protecting internal components from damage caused by external impact and vibration; - Extends service life by shielding electronic components from moisture and dust; - Improves reliability by reducing the likelihood of cracking and corrosion due to stress concentration; - Boosts production efficiency through rapid heat-curing, thereby lowering manufacturing costs. Domestic Alternative: Replaces Loctite 4531 and Namics U8410 series.