Ducted Series Semiconductor Cooling Module - TP23070

The ducted module series utilizes a high-density heat sink to force convection heat transfer through the equipped air ducts and high-pressure fan. This provides a reliable, efficient and compact design concept for semiconductor cooling modules. Provides point-to-point cooling and heat transfer over long distances. The series is available in standard and customized configurations with two heat transfer mechanism configurations, air to air and direct to air. The modules are characterized by compact design, small size, high reliability, precise temperature control, DC power supply, and compliance with environmental standards. Translated with www.DeepL.com/Translator (free version)